Cleaner

Parameter Table

Product Description

In the integrated circuit manufacturing process, cleaners are often used in the following fields:

Surface cleaning: During the integrated circuit manufacturing process, surface cleaning of semiconductor chips, wafers, chip packages, printed circuit boards (PCBs), etc. is required to remove dust, grease, residues and other dirt to ensure surface cleanliness and finish

Equipment cleaning: Various equipment and tools on the production line, such as chemical vapor deposition equipment, photolithography equipment, thin film deposition equipment, etc., also need to be cleaned and maintained regularly to ensure their normal operation and production quality

Environmental cleaning: The floors, walls, facilities and equipment of production workshops and laboratories also need to be cleaned regularly to maintain the cleanliness and hygiene of the production environment.

However, during the integrated circuit manufacturing process, special attention needs to be paid to selecting appropriate cleaning agents to avoid damage to electronic components and equipment. In general, use cleaners specifically designed for use on electronics and sensitive components and use them in strict accordance with the supplier's instructions and operating procedures to ensure safety and reliability. Additionally, special deionized water or other purification processes may be required for final cleaning and washing.

In the integrated circuit manufacturing process, cleaning fluids are often used to remove dirt, grease and other organic and inorganic residues generated during the production process to ensure the quality and performance of the circuit. Some commonly used cleaning solutions include acetone, isopropyl alcohol, deionized water, etc. Cleaning fluids is often used at different stages of the manufacturing process, such as to clean surfaces after topographic coating, photolithography, etch, etc., or to clean chips and devices before packaging and testing. The selection of cleaning fluids needs to take into account factors such as material compatibility, cleaning effectiveness and safety, and strict operating procedures need to be followed to ensure their correct use and avoid harm to the environment and personnel. controling and optimization of the cleaning process are important to ensure accuracy and reliability in circuit manufacturing.