Etchant
Parameter Table
| Application Area | Classification |
Product Name |
Another Name |
Product Quality |
| TFT-LCD | Etchant |
Aluminum Etchant | Al Etchant | < 100ppb |
| Copper Etchant | Cu Etchant | < 100ppb | ||
| ITO Etchant | ITO Etchant | < 100ppb | ||
| Phosphoric Acid | H3PO4 | < 100ppb | ||
| Nitric Acid | HNO3 | < 100ppb | ||
| Acetic Acid | CH3COOH | < 100ppb | ||
| Hydrogen Peroxide Solution | H202 | < 100ppb | ||
| Silver Etch | Ag Etchant | < 100ppb |
Product Description
Etchant (etchant) is widely used in metal processing, semiconductor manufacturing, electronic component manufacturing, chip manufacturing and scientific research. In metal processing, etchants are used to remove oxides or unwanted material from metal surfaces, thereby improving the quality and characteristics of metal parts. In semiconductor and electronics manufacturing, etchants are used to create tiny structures and circuits. In the field of scientific research, etchants can be used to prepare samples to observe their microstructure. In summary, etchants have important applications in many fields.
In the semiconductor manufacturing process, Etchant is a chemical solution used to perform local etching on chips and other semiconductor devices. This etching is used to create tiny structures such as channels and vias that define the chip's circuitry and other features. Typically, Etchant is applied to specific areas of a semiconductor device, through masking technology or other means, in order to achieve the desired patterns and structures. The depth and accuracy of etching can be adjusted by controlling Etchant's composition, temperature and etching time. Therefore, in the semiconductor manufacturing process, Etchant is an important process material used to define and form the fine structures on the chip.
Etchant (etchant) is commonly used to process printed circuit boards (PCBs) during electronic component manufacturing, particularly in chemical etching processes. Its function is to remove unnecessary parts covering the surface of the copper foil to form the required circuit pattern. The specific usage steps are as follows: Design the desired circuit pattern and transfer it to the copper foil surface. Dip the PCB into Etchant, which will remove only the unprotected copper foil, leaving the desired circuit pattern. Control the etching time to ensure that only the required copper foil is removed. In this way, Etchant can help create the required circuit patterns, a crucial step in the PCB manufacturing process.
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