High Purity IC Grade Chemicals from China - Reliable Suppliers & Factory for Electronic Component Manufacturing
| Application Area | Classification | Product Name |
|---|---|---|
| IC | Formulated Chemicals | Mirror thinning on the back side of the wafer |
| Atomization and thinning of the wafer backside | ||
| Etching of polysilicon and silicon substrates | ||
| Oxide etching and wafer cleaning | ||
| Metal film etching | ||
| Nitrogen-silicon/oxy-silicon isokinetic etching | ||
| Selective etching of indium gallium zinc oxide | ||
| Selective etching of nitrogen-silicon/oxy-silicon | ||
| SiN/AlO, selective etching of SiN/TiN | ||
| Phosphoric acid additives, CMP abrasives | ||
| A new generation of HK material etching fluids | ||
| Etching of molybdenum | ||
| Etching of Sc-AlN-doped | ||
| Selective etching of SiGe | ||
| The back side of the wafer is thinned and highly doped silicon is selectively etched | ||
| In etching, the selection ratio of silicon oxide to silicon nitride etching is more than 200 | ||
| In etching, the etching selection ratio of silicon oxide to aluminum is more than 50 | ||
| Etching fluids can infiltrate deep trenches to etch the silica media they deposit to a specific depth | ||
| Gate silicon oxide can be etched and has good uniformity | ||
| Photoresist diluent | ||
| Control bezel wafer regeneration | ||
| Dry etching residue removal | ||
| Dry etching residue cleaning in aluminum process (>130nm) | ||
| Dry etching residue cleaning in copper process (130nm-40nm) | ||
| Copper process: dry etching residue cleaning with TiN hard mask (40nm-12nm) | ||
| It is used for 10nm process AlOx cleaning and removal | ||
| Lift-off process light resistance removal | ||
| Lift-off process light resistance removal |
Formulated Chemicals are commonly used in a variety of ways in the manufacture of integrated circuits and display panels. Some common uses include:
Formulated Chemicals can be used to prepare photoresists to define fine structures on circuit boards or display panels. These chemicals play a key role in the photolithography process, helping to create precise patterns and structures.
Formulated Chemicals are used in manufacturing processes to clean and remove residues, such as organic and inorganic residues generated during production.
Some Formulated Chemicals can be used in a variety of chemical reactions and deposition processes, such as preparing functional layers with specific conductivity or optical properties.
Formulated Chemicals can also be used to ensure product quality and consistency, for example by controlling surface treatments and process conditions.
Formulated Chemicals are mainly used in photolithography processes (to prepare photoresists), cleaning and residue removal, chemical reactions and deposition, and ensuring product quality and consistency during manufacturing.
High ion content can negatively impact the performance of electronic components. Therefore, steps are strictly taken during production to minimize ionic carryover and ensure optimal component operation.
IC grade chemicals must have extremely high purity, low ionic residue, low residue content, accurate/stable chemical properties, and strict compliance with relevant industry safety and quality standards.
They are used to prepare photoresists which define fine structures on circuit boards or display panels, playing a key role in creating precise patterns and structures.
Safe operating procedures must be strictly followed. Handling, storage, and disposal must be carried out in an appropriate, controlled environment by trained operators.